Thermal conductive polyurethane potting adhesive
The JOMP 2606 A/B is a solvent-free, two-component casting resin, based on Polyurethane. The resin (A) consists of organic compounds with hydroxyl-groups whereas the hardener (B) is based on isocyanates. By mixing both components in a ratio by weight of 100:20 a semi-tough casting resin is achieved via chemical reaction. The product exhibits no measurable change in volume after curing.
Detailed introduction
The resin is used for filling, coating and casting. The product adheres well to metals and plastics. It contains flame retardant additives The JOMP 2606 A/B is a solvent-free, two-component casting resin, based on Polyurethane. The resin (A) consists of organic compounds with hydroxyl-groups whereas the hardener (B) is based on isocyanates. By mixing both components in a ratio by weight of 100:20 a semi-tough casting resin is achieved via chemical reaction. The product exhibits no measurable change in volume after curing. .
Low viscosity, fast curing in several hours
Excellent performance on low-temperature and aging
Excellent and stably electrical dielectric
Very low Water absorption
Good adhere to most metals and plastics
Applications
It is specifically formulated for automotive sensors, switches, transformers and other electrical devises requiring environments protection.
Technical performance
Item | Unit | Method | JOMP 2606 WT | JOMP 2606 BK | ||
Appearance |
B A+B |
--- | Visual inspection | White liquid Black liquid | ||
Visual inspection | Brown liquid | |||||
Visual inspection | White liquid Black liquid | |||||
Viscosity |
B A+B |
25℃ mPa·s | GB/T 10247-2008 | 2,000-6,000 2,000-6,000 | ||
GB/T 10247-2008 | 20-40 20-40 | |||||
GB/T 10247-2008 | 800-1200 800-1200 | |||||
Density |
B A+B |
25℃ g/cm3 | GB/T 15223-1994 | 1.58±0.05 1.58±0.05 | ||
GB/T 15223-1994 | 1.23±0.05 1.23±0.05 | |||||
GB/T 15223-1994 | 1.53±0.05 1.53±0.05 | |||||
Mix ratio | By weight |
---- | A: B=100:20 | |||
Pot life | 25℃ min ， 150g | GB/T 10247-2008 | 30-40 30-40 | |||
Initial curing time | 25℃ , 55%RH,hr | GB/T 10247-2008 | 10-12 10-12 | |||
Cure condition | ℃/h ， 100g | GB/T 10247-2008 | 25℃/24h or 80℃/2h | |||
According to the quantity of mixing glue, 174g.
Properties after cured | Apply for Electronic Components | |||
Item | Unit | Method | JOMP 2608-WT JOMP 2608-BK | |
Hardness | Shore-A | GB/T 531-2008 | 82 ± 5 82 ± 5 | |
Dielectric strength | 25℃ , kV/mm | GB/T 1695-2005 | 20 20 | |
Thermal conductivity | W/m.K | GB/T10297-1998 | 0.82±0.03 | |
Volume resistivity | 25℃ , Ω·cm | GB/T 1692-92 | 1.2*1014 1.2*1014 | |
Dielectric constant | 50Hz ，25℃ | GB/T 1693-2007 | 4.3 4.3 | |
Elongation | % | GB/T 528-2009 | 50% 50% | |
Tensile strength | 25℃,Mpa | GB/T 528-2009 | 7.2 7.2 | |
Shear strength | 25℃,Mpa |
GB/T 7124-2008 | Fe: 5 Mpa Al: 3.5 Mpa | Fe: 5 Mpa Al: 3.5 Mpa |
Glass transition temperature |
℃ |
DSC |
-5 -5 | |
Loss factor | 25℃@1MHz | GB/T 1693-2007 | 0.015 0.015 | |
Curing shrinkage | % | HGT 2625-1994 | 1.0 1.0 | |
Coefficient of linear expansion |
ppm |
GBT 20673-2006 | <Tg, 55 >Tg, 140 | <Tg, 55 >Tg, 140 |
Working temperature range | ℃ |
GBT 20028-2005 | -50～150 -50～150 | |
Packing and transportation
lJOMP 2606 BK (Black), lJOMP 2606 WT(White),
lPart A: 25 kg/Barrel ；lPart B: 4 kg/Barrel
