1.0 W thermal conductivity epoxy potting adhesive
JOME 3113-1A/B is a two-component solventless, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance.
Detailed introduction
Before cured | Item | Method | Unit | JOME 3113-1 A | JOME 3113-1 B |
Appearance | Visual inspection | --- | Black Liquid | Beige paste | |
Viscosity | GB/T 10247-2008 | 25τ , mPa ·s | 20,000±3,000 | 25 | |
Density | GB/T 13354-92 | 25τ , g/cm3 | 2.35±0.05 | 0.93±0.05 | |
Mix rate | Mass ratio | Ratio=A:B | 100 ：8 | ||
Mix viscosity | GB/T 10247-2008 | 25τ , mPa ·s | 2,000±300 | ||
Operation time | GB/T 10247-2008 | 25τ , min | 45 | ||
Gel time | GB/T 10247-2008 | 60τ , min | 60 | ||
After cured | Hardness | GB/T 531.1-2008 | Shore D | 90 | |
Thermal conductivity | GB/T 10297- 1998 | W/mK | 1.2±0.1 | ||
linear thermal expansion coefficient | GB/T 20673-2006 | μm/（ m ，τ) | 20 | ||
glass transition temperature | DSC | τ | 95 | ||
Shear strength | GB 6328-86 | Mpa ，Fe-Fe | ≥8 | |
Shear strength | GB 6328-86 | Mpa ，Al-Al | ≥8 | |
Dielectric strength | GB/T 1693-2007 | kV/mm（25τ) | ≥18 | |
Loss factor | GB/T 1693-2007 | （1MHz）(25τ) | 0.09 | |
Dielectric constant | GB/T 1693-2007 | （1MHz）(25τ) | 2.9 | |
Volume resistance | GB/T 1692-92 | DC500V,Ω· cm | 1.00E +15 | |
Applying temperature | GBT 20028-2005 | τ | -50-- 200 |
Note:1. The above data curing conditions tested were 100 ℃ * 2h
2. The measured data table is under a specific condition, for reference, the resulting data does not guarantee that the client can fully consistent with the actual use.
FEATURES
lHeat curing will bring high heat resistance
lExcellent adhesion, anti-cracking
lLow CTE linear expansion coefficient
lHaving a high thermal conductivity
lExcellent electrical insulation, stability
lLong-term use at -50 ℃ - 200 ℃
lVery low water absorption, good waterproof, moisture resistance
Operation process
lPreparation: Put A material original packaging barrels at 40℃ environment preservation 2 hours, after take out, compound viscosity is thinning, lower.
lOr use directly at normal room temperature.
lMixing ：With the A component of the filler will contain the time to precipitate down, so use a stirrer to make the filler and resin liquid mixed evenly. ThenweighingA / B components with Ratio 100:8, mixingthoroughly for several minutes. After, the finished liquid will be ready for potting.
lComponent B may occur during storage or agglomeration of crystal (a normal case), if required before use crystalline placed in an oven at 60 ℃to melt it, and then cooled to room temperature and after use, which does not affect its performance.
lThe exposed component B will be hydrolyzed in moisture and the color of hydrolysate will show the color of white as friable powder.
lGood potting device, if necessary, vacuum may continue to help increase the electrical properties of the device.
Curing conditions
Recommendedcuring process would be chosen as below:
l25℃* 24h at room temperature
l80℃ * 3h
l100℃ * 2h, reach the heat resistance grade B;
l100 ℃ * 2h + 120 ℃ * 1h , reach the heat resistance grade F;
lIf working temperature is below 150 ℃ , the final curing temperature can be ignored.
Packing and Stocking
lAvoid the sun and heat, stock under sealing.
lShelf life at 25℃: Part A 12 months, part B 12 months;
lIf expired should be tested first.
lPart A :20kg/plastic drum; Part B: 0.8kg/bottle or 2.4kg/pot
