3102   General purpose

For general electronic components potting and circuit board closure.
Room temperature can be cured, curing process exothermic temperature is low, low shrinkage

Cured bright surface,no cracking, moisture,insulation

3105
Thermal type

For high-power electronic components on the heat requirements of the
higher modules and circuit board potting protection.

After the glue has cured heat dissipation,
and other properties, like 3102

3108
Transparent type

Required for a transparent potting of electronic components and modules,
particularly for use in normal lighting requirements transparent potting

Room temperature curing, curing after the high
transparency,
other properties ,like 3102

3115
Heat-resistant type

For general heat-resistant electronic components potting and circuit
board closed

Mixing glue after a long time to use, heated at 80  ℃ in 2 to 3  hours full curing, and could be  used at temperature 180  ℃ .

3112
Flame       retardant
type

For the requirements of flame retardant small and medium-sized electronic
devices potting and circuit board closed, such as  capacitor enclosures, solid state relay potting, etc

Otherproperties like 3102