Thermal conductive fillers can be divided into two categories: thermal conductive inorganic insulation fillers and thermal conductive non insulation fillers. Thermal conductive inorganic insulation fillers include Al2O3, BN, AlN, ZnO, MgO, etc; Non insulating thermal conductive plastic fillers include metal powder, graphite, carbon black, carbon fiber, carbon nanotubes, graphene, and other materials with high conductivity and thermal conductivity. The former can be mixed with a polymer material matrix to produce thermal insulation materials, while the latter is a thermal non insulation composite material.

The influence of different fillers on thermal conductive potting adhesive varies, and the amount used also has a significant impact on the adhesive. Different combinations of various fillers can produce different effects. Currently, the commonly used types of thermal conductive potting adhesive fillers are as follows:

1. Fillers for improving impact resistance include asbestos fiber, glass fiber, mica powder, and aluminum powder.

2. Fillers that can improve their hardness and compressive performance include metals and their oxides such as quartz powder, chromium oxide powder, porcelain powder, iron powder, cement, boron carbide, etc.

3. The fillers used to improve its heat resistance include asbestos powder, silicone powder, phenolic resin, ceramic powder, and titanium dioxide powder.

4. Fillers that increase adhesion include aluminum oxide powder, ceramic powder, and titanium dioxide powder.

5. Fillers that increase thermal conductivity include aluminum powder, copper powder, iron powder, and graphite powder.

6. Fillers that increase conductivity include silver powder.

7. Fillers that increase lubricity include graphite powder, high clay powder, and aluminum disulfide powder.

Method for improving the thermal conductivity of thermal conductive potting adhesive

1. Preparation of intrinsic thermal conductive materials, which involves changing the chain structure of the polymer itself to obtain a special physical structure and improve its thermal conductivity

2. Fill the polymer with high thermal conductivity filler particles to prepare a filled thermal conductive composite material. Due to the complexity, difficulty, and high cost of the preparation process of intrinsic thermal conductive materials, it is difficult to achieve large-scale production, so there is less research on this aspect. For filled thermal conductive composite materials, the thermal conductivity of the matrix is generally poor, and the thermal conductivity of the composite material mainly depends on the thermal conductivity of the filler and its role in the composite material. Therefore, fillers are a key factor affecting the thermal conductivity of polymer composites. The above is what JOME shared about the types of thermal conductive potting adhesive fillers and methods for improving performance,Please keep an eye on JOME for more knowledge about thermal conductive potting glue, thermal conductive gel and thermal conductive silicone grease~